SAWCUT®

Green Laser Diamond Sawing & Shaping

The SAWCut is a Diamond Sawing Green Diode Laser system technology that performs a smooth cut of the rough and fancy diamond surface and by doing so, drastically minimizes the waste from the rough material.

The manufacturing process of the diamond commences with the analysis of its surface, carries on with the designing and marking of the diamond by means of the OGI Marker, after which the marked stone is tranferred to the SAWCut Diamond Sawing Laser System, which has the ability to act upon the information derived from the stone's markings, utilizing its maximum potentiality in the manufacturing process of the rough stone.

SAWCut Diamond Laser Sawing Key Features:

  • State-of-the-art 100W high power YAG laser
  • Single or double-sided sawing to reduce weight loss
  • Smooth surface sawing
  • Reduced weight loss in final polishing
  • Built-in shape editor- creates and customizes shapes
  • Low maintenance system
  • High accuracy fancy shape
  • Very powerful and user friendly software
  • Fast investment return
  • Capable of interfacing with other OGI rough analyzers: OGIMarker, OGIScanner, OGIRough and OGITender, in order to get maximum yield of the diamond to be cut.






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    Technical Information:

  • Dimensions:
  • 190cmL x 180cmH x 90cmW
  • Voltage: 220V
  • Weight: 420Kg (926 Pound)
  • Laser Source: YAG green laser
  • Wave Length: 532nM
  • Axis travel:
  • 200 mm x 200 mm x 50 mm
    (we can supply Higher)
  • Product Options & Extensions:
  • Stone Setting Tool
  • Double-sided Sawing Cassette
  • Power Meter
  • Air Compressor
  • Cassette for 18 and 54 stones
  • Shape Cassette for 80 stones
  • Dops
  • Protective Google
  • Glue
  • SAWCut

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