The PHOENIX Green Diode Laser system technology performs a smooth cut of the rough and fancy diamond surface and by doing so, drastically minimizes the waste from the rough material.
The manufacturing process of the diamond commences with the analysis of its surface, carries on with the designing and marking of the diamond by means of the OGI Marker, after which the marked stone is tranferred to the SawCut Gren Diode Laser System, which has the ability to act upon the information derived from the stone's markings, utilizing its maximum potentiality in the manufacturing process of the rough stone.
Key Features:
State-of-the-art 100W high power YAG laser
Single or double-sided sawing to reduce weight loss
Smooth surface sawing
Weight loss in final polishing
Built-in shape editor- creates and customizes shapes
Low maintenance system
High accuracy fancy shape
Very powerful and user friendly software
Fast investment return
Capable of interfacing with other OGI rough analyzers: OGIMarker, OGIScanner, OGIRough and OGITender, in order to get maximum yield of the diamond to be cut.
